If you’re in the electronics industry, you use the IPC standards for the design, manufacture and assembly of printed circuit boards. Now the popular standard IPC 6013, “Qualification and Performance Specification for Flexible Printed Boards,” has been revised. The new Revision C replaces all previous editions through Revision B, as well as the now obsolete IPC RF 245 and IPC FC 250. The standard provides requirements for the qualification and performance of flexible boards that are design to meet the IPC 2221 and IPC 2223 documents.
You’ll use the IPC 6013 for single-sided, double-sided, multilayer or rigid-flex multilayer flexible boards. You’ll be able to use a variety of constructions, including stiffeners, plated-through holes, or blind/buried vias if you choose. And the rigid section can contain a metal core or an external metal heat frame as well.
The standard is one of the two most popular IPC flexible circuit standards, along with the IPC 4203 (also recently updated to Revision A). This Revision C for IPC 6013 is a technical revision of the standard. Your committee has provided you with information on the changes from the previous issue in section 1.7.
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