Document Center Inc. announces the availability of a new JEDEC Standard, JESD-9 Revision B dated 5/1/2011. Titled “Inspection criteria for microelectronic packages and covers,” the standard’s purpose is to verify the workmanship and requirements of microelectronic packages and covers (lids) used in fabricating hybrid microelectronic circuits/microcircuits.
This standard establishes the general requirements and quality assurance provisions that can be specified and met in procuring microelectronics packages and covers, manufactured from matched seal with and without high thermal conductivity base materials, intended for use in fabricating hybrid microelectronics circuits. This document details those minimum requirements necessary for metal and ceramics packages’ use.
The previous edition, JESD 9 Revision A, covered only metal packages and JESD 27 covered ceramic ones. However the new Revision B covers both and so replaces JESD 27, Ceramic Package Specification for Microelectronic Packages. The new edition is meant to be used in conjunction with MIL-STD-883, Test Method 2009: External Visual.
JESD-9 is applicable for use by the package manufacturer (i.e., package components) and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit).
These JESD standards, and all standards from JEDEC, can be purchased at Document Center Inc.’s website, www.document-center.com. Or phone us (650-591-7600), fax us (650-591-7617) or email us (firstname.lastname@example.org). We’re happy to assist you with all your standards requirements.