New IEC PAS 62878-2-5 – Data Format for Device Embedded Substrates

IEC PAS 62878-2-5, “Device embedded substrate – Guidelines – Data format,” has just been released.  This is a publicly available specification taken directly from the JPCA (Japan Electronics Packaging and Circuits Association) standard JPCA-EB02 from 2011.  The IEC PAS 62878-2-5 is published as a dual logo standard (with both IEC and JPCA noted on the cover).  It will be valid for 3 years as it is considered a “pre-standard.”

So what exactly is IEC PAS 62878-2-5 about?  It defines the data format for active and passive devices that are embedded inside an organic board.  The electrical connections are made using via, electroplating, conductive paste or conductive material printing.  This type of structure is described in JPCA’S EB01, “Standard of device embedded substrate.”

This type of substrate is interesting since it is connected in a 3D way.   Although several suggestions have been made for methodologies for describing this 3D format, they can’t describe structures that have been defined by the JCPA EB01.  Only the EB02 does this successfully, using a new format called FUJIKO V-1.0.  This format allows for the design data to be used as CAM data in actual production.

So the IEC PAS 62878-2-5 describes the FUJIKO V-1.0 format and the expression of 3D data, the layer concept, the structure of the board data and definitions of repeatly used information it provides.  It is a 42-page specification with many color diagrams to help you understand the concepts it covers.

What information will you get from the IEC PAS 62878-2-5?  In the scope material, the features of this format are introduced.  Then Clause 2 discusses the file description used.  This includes 3D expression, the various layers and the data associated with them.  Clause 3 is terminology and Clause 4 is commentary, with additional information.

However, the much of the material is presented as a series of figures and tables.  These include such topics as the construction of mounting layers, bonding wire information, definitions of SiP, module and MEMS, and a list of data.  These figures and tables are featured throughout the publication.

What does the PAS designation mean?  A PAS (Publicly Available Specification) is the IEC publication designation for a technical specification that has not gone through the requirements for a standard.  However, because of some technical or other need, the document is being made available on a limited-time basis.  The document is considered to be “in line” for completing the adoption process as a standard (pre-standard).

How can you get an authorized copy of the IEC PAS 62878-2-5?  You’ll use Document Center Inc.  You can easily order any IEC publication at our webstore, www.document-center.com.  Here’s a link directly to the order page for IEC PAS 62878-2-5.  It can be ordered online in either paper format or for pdf download.

Want your copy for use by more than one person?  Contact our staff for information on including it in a Standards Online subscription service.  You can reach them by phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com).  We’re always happy to help you with any question you may have on this type of conformance material.  We’re your Standards Experts!