IPC-T-50, “Terms and Definitions for Interconnecting and Packaging Electronic Circuits,” has just been updated. The new Revision M is available from Document Center in paper format, for pdf download, in CD Rom format, and as a kit with both the paper and CD Rom copies included. As IPC says, the IPC-T-50 defines the “language of an industry.” It allows users to understand terms both by written definitions and the use of illustrations for better clarity.
What’s new in the IPC-T-50 M? There are over 220 new or revised terms. The new definitions include including terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology. And some out-of-date terminology has been removed from the 123-page publication as well. This new edition replaces the now-obsolete Revision K from 2013, so it’s been about 2 years since the last revision.
Who should be using the IPC-T-50 M? OEM, EMS or ODM Companies will all find the document can facilitate communications between staff and customers as well as ensuring a common understanding within the organization itself.
What about acronyms? Acronyms used in the electronics industry are addressed in the publication’s Annex. This is an invaluable aid in an industry beset by the use of acronyms!
What format of the IPC-T-50 is right for me? Your document comes in single-user editions by default. So while the CD Rom and the paper copy have a certain amount of portability, the pdf copy is definitely for the use of 1 person only. And you’ll need to remember that electronic copies of the IPC standards do have the print function disabled. So when using either the CD Rom or the pdf formats, your electronic copy will be your only copy, no printing allowed. So make your choice based on these limitations.
Where can I get my copy of the IPC-T-50? This is a copyright publication and must be purchased from an authorized distributor like Document Center Inc. Order online at our webstore, www.document-center.com. Or use this link to the order page for IPC-T-50 now. Have questions and want to work with a real person? Contact our staff by phone (650-591-7600), fax (650-591-7617) or email (email@example.com). Our staff is well known for being responsive — Your call or email will be answered by someone with the expertise to answer any questions you might have. Make Document Center your Standards Experts!
There’s a new IPC T 50 Revision K, “Terms and Definitions for Interconnecting and Packaging Electronic Circuits,” and it’s available now. The standard contains 120 pages of definitions, listed alphabetically, with a classification code that allows for review of terms by topic. Additionally, Appendix A is an Acronym Listing, which can be handy when working with standards!
Changes in the IPC T 50 Revision K include more than 220 new or revised terms. These include new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology.
Another nice thing about this standard is the liberal use of figures and tables to illustrate exactly what is meant by various terms. These examples can be in the form of flow charts (circuit design), drawings (printed board viewing orientations), graphs (typical characteristic curve) or formulas (feature location).
Document Center Inc. is an authorized reseller of the IPC standards. Most are available in both paper and CD Rom format, although the CD Rom’s have the print functionality suppressed.
You can purchase IPC Standards, including the new IPC T 50, at our web store, www.document-center.com. Or contact us by phone (650-591-7600), fax (650-591-7617) or email (firstname.lastname@example.org).
We have been working with electronics companies since our founding in 1982. If this is your industry, consider making Document Center your primary standards resource. We have many support services that help customers like you make more effective use of their resources by relying on Document Center to handle monitoring requirements for standards collections. And we offer current awareness services via our StandardsInformer product and our blog.document-center.com.
IPC-T-50 Revision J, titled “Terms and Definitions for Interconnecting and Packaging Electronic Circuits,” has just been released. This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers.
The new 121-page Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. IPC-T-50 also includes commonly used industry acronyms.
The standard was developed by the Terms and Definitions Committee of IPC. It replaces all previous editions of the standard through Revision H dated 2008.
This standard and all IPC documents are available from Document Center Inc. at our website, www.document-center.com. Or you can contact us by phone (650-591-7600), fax (650-591-7617) or email (email@example.com). We’ve been an authorized distributor of the IPC standards since the 1980’s.
MIL-STD-883 Revision H, entitled “Test Method Standard – Microcircuits,” is Document Center’s all-time best selling military standard. It provides approximately 700 pages of tests for microelectronic devices suitable for use within Military and Aerospace electronic systems. It includes basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; and workmanship and training procedures.
Revision H was released on 2/26/2010 and compliance with the standard was required by 9/30/2010. Usage of the standard is mandated as part of a contract with the U.S. government.
The document is intended to be used in conjunction with several other major military documents:
MIL-PRF-19500 – Semiconductor Devices, General Specification For.
MIL-PRF-38534 – Hybrid Microcircuits, General Specification For.
MIL-PRF-38535 – Integrated Circuits (Microcircuits) Manufacturing, General Specification For.
MIL-STD-1835 – Electronic Component Case Outlines.
MIL-HDBK-217 – Reliability Prediction of Electronic Equipment.
MIL-HDBK-505 – Definitions of Item Levels, Item Exchangeability, Models, and Related Terms.
There are also references to a number of industry standards that are basic to any standard library for electronic devices:
ISO 14644-1 – Cleanrooms and Associated Controlled Environments – Part 1: Classification of Air Cleanliness.
ISO 14644-2 – Cleanrooms and Associated Controlled Environments – Part 2: Specifications for Testing and Monitoring to Prove Continued Compliance with ISO 14644-1.
IPC-T-50 – Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
ANSI/NCSL Z540.3 – Requirements for the Calibration of Measuring and Test Equipment, General Requirements
ANSI/J-STD-004 – Requirements for Soldering Fluxes
ANSI/J-STD-005 Requirements for Soldering Pastes
ANSI/J-STD-006 – Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications
IPC/EIA/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.
EIA/JESD 22-B116 Wire Bond Shear Test
EIA/JESD 78 IC Latch-up Test.
EIA-557 Statistical Process Control Systems.
ASTM E263 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Iron.
ASTM E264 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Nickel.
ASTM E265 – Standard Test Method for Measuring Reaction Rates and Fast-Neutron Fluences by Radioactivation of Sulfur-32.
ASTM E666 – Standard Practice for Calculating Absorbed Dose from Gamma or X-Radiation.
ASTM E668 – Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose on Radiation Hardness Testing of Electronic Devices.
ASTM E720 – Standard Guide for Selection and Use of Neutron Sensors for Determining Neutron Spectra Employed in Radiation-Hardness Testing of Electronics.
ASTM E721 Standard Method for Determining Neutron Energy Spectra with Neutron-Activation Foils for Radiation-Hardness Testing of Electronics.
ASTM E722 – Standard Practice for Characterizing Neutron Energy Fluence Spectra in Terms of an equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics.
ASTM E801 Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices.
ASTM E831 Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis
ASTM E1249 – Minimizing Dosimetry Errors in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1250 – Standard Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt 60 Irradiators Used in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1275 – Standard Practice for Use of a Radiochromic Film Dosimetry System.
ASTM F458 – Standard Practice for Nondestructive Pull Testing of Wire Bonds.
ASTM F459 – Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds.
ASTM F526 – Standard Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests.
ASTM F1892 – Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices.
ASTM C177 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded Hot-Plate Apparatus.
ASTM C518 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus.
ASTM D150 – Standard Test Methods for A-C Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials.
ASTM D257 – Standard Test Methods for D-C Resistance or Conductance of Insulating Materials.
ASTM D1002 – Standard Test Method for Strength Properties of Adhesives in Shear by Tension Loading (Metal-to-Metal).
ASTM D3850 – Standard Test Method for Rapid Thermal Degradation of Solid Electrical Insulating Materials By Thermogravimetric Method (TGA).
The MIL-STD-883, both the current Revision H and previous editions, as well as the other standards noted above, are all available from Document Center Inc. Use our website, www.document-center.com, or phone (650-591-7600), fax (650-591-7617) or email us (firstname.lastname@example.org). Any questions or comments you may have are welcome.