Posts Tagged ‘Mechanical Test Method for Semiconductor Devices Part 2: Test Methods 2001 through 2999’

New MIL-STD-750 Revision F changes format to this Popular Standard for Test Methods for Semiconductor Devices

Friday, January 20th, 2012

The new MIL-STD-750 Revision F, “Test Methods for Semiconductor Devices,” has just been released.  Not only is this a new revision level for this standard, but the format has also changed with the addition of five new parts.  This is one of the most frequently ordered Military Standards here at Document Center Inc. — a real staple of the Semiconductor Industry.

This standard establishes uniform methods and procedures for testing semiconductor devices suitable for use within Military and Aerospace electronic systems. The methods and procedures in the various parts of this standard cover basic environmental, physical, and electrical tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations.

For the purpose of MIL-STD-750F, the term “devices” includes such items as transistors, diodes, voltage regulators, rectifiers, tunnel diodes, and other related parts. This standard is intended to apply only to semiconductor devices. The test methods and procedures described in the various parts of this multipart test method standard have been prepared to serve several purposes:

a. To specify suitable conditions obtainable in the laboratory that give test results equivalent to the actual service conditions existing in the field and to obtain reproducibility of the results of tests. The test methods described by this standard are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic location since it is known that the only true test for operation in a specific location is an actual service test at that point.

b. To describe, in a series of standards, all of the test methods of a similar character which now appear in the various joint-services semiconductor device specifications so that these test methods may be kept uniform and thus result in conservation of equipment, man-hours, and testing facilities. In achieving this objective, it is necessary to make each of the general test methods adaptable to a broad range of devices.

c. The test methods described by this standard for environmental, physical, and electrical testing of semiconductor devices shall also apply, when applicable, to parts not covered by an approved military sheet-form standard, specification sheet, or drawing.

MIL-STD-750 is now divided into 6 parts:

MIL-STD-750, Revision F, “Test Methods for Semiconductor Devices,” an overview document.

MIL-STD-750-1, Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 through 1999,

MIL-STD-750-2, Mechanical Test Methods for Semiconductor Devices Part 2: Test Methods 2001 through 2999

MIL-STD-750-3, Transistor Electrical Test Methods for Semiconductor Devices Part 3: Test Methods 3000 through 3999

MIL-STD-750-4, Diode Electrical Test Methods for Semiconductor Devices Part 4: Test Methods 4000 through 4999

MIL-STD-750-5, High Reliability Space Application Test Methods for Semiconductor Devices Part 5: Test Methods 5000 through 5999

Documentation and process conversion necessary to comply with this revision shall be completed by 3 July 2012.  The margins of the standard are marked with vertical lines to indicate where changes from the previous issue were made. This was done as a convenience only and the Government assumes no liability whatsoever for any inaccuracies in these notations.

MIL-STD-750, including all the new revisions plus obsolete editions as well, is available for purchase from Document Center Inc.  Use our website, www.document-center.com, or phone us (650-591-7600), fax us (650-591-7617) or email us (info@document-center.com).  We can help you keep up with the rapidly changing world of compliance information.