The new MIL-STD-883 Revision J, “Microcircuits,” has just been released. The Test Method Standard is the primary resource for the microcircuit tests required for military contract work here in the U.S. Compliance with the new Revision J will need to be completed by December 4, 2013.
MIL-STD-883 establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems. These include:
- basic environmental tests to determine resistance to the elements and conditions surrounding military and space operations,
- mechanical and electrical tests,
- workmanship and training procedures, and
- other requirements to ensure a uniform level of quality and reliability suitable for military applications.
Changes have been made to a broad spectrum of these various test methods. The tests that have been updated include:
- 1007.1, Agree life
- 1014.14, Seal
- 1017.3, Neutron irradiation
- 1018.7, Internal gas analysis
- 1019.9, Ionizing radiation (total dose) test procedure
- 2003.10, Solderability
- 2004.7, Lead integrity
- 2009.11, External visual
- 2010.13, Internal visual (monolithic)
- 2011.9, Bond strength (destructive bond pull test)
- 2012.9, Radiography
- 2015.14, Resistance to solvents
- 2017.10, Internal visual (hybrid)
- 2018.6, Scanning electron microscope (SEM) inspection of metallization
- 2019.9, Die shear strength
- 2022.3, Wetting balance solderability
- 2023.7, Nondestructive bond pull
- 2029.1, Ceramic chip carrier bond strength
- 2030.2, Ultrasonic inspection of die attach
- 2036.1, Resistance to soldering heat
- 2037, X-Ray Fluorescence (SRF) Scan for Tin (Sn)-Lead (Pb) Content Analysis
- 3015.9, Electrostatic discharge sensitivity classification
- 3016.1, Activation time verification
- 3023.2, Static latch-up measurements for digital CMOS microelectronic devices
- 5004.12, Screening procedures
- 5005.16, Qualification and quality conformance procedures
- 5007.8, Wafer lot acceptance
- 5011.6, Evaluation and acceptance procedures for polymeric adhesives
- 5013.1, Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers
As you can see, every test section of MIL-STD-883 has been affected with the exception of the Linear Electrical Tests (the 4000 series).
The MIL-STD-883 remains one of our best selling Military Standards, historically well-used by the semiconductor industry here in Silicon Valley. If you need a copy, you can order it at our web store, www.document-center.com. Or contact us by phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com).
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