MIL-STD-883, Microcircuits, has been updated. The new release is Revision K with Change Notice 2. It is available from Document Center Inc. now in both paper format and for pdf download. This is an essential test method standard for the electronics industry. You’ll want the new edition if you use this document.
While the Change Notice 1 for Revision K focused in on only 1 test method (1018 on internal gas analysis was completely rewritten), Change Notice 2 has a long list of corrections. Here is the summary straight from the document itself:
1005.11: TABLE 1 Notes: Corrected typo, changing “pressures” to “temperatures”
1014.16: 1.1.c Note added to provide clarification of the conversion.
1014.16: 22.214.171.124 Clarifiation of the mass spectometer’s sensitivity.
1014.16: 2.4.4 Clarifiation of the mass spectometer’s sensitivity.
1014.16: 126.96.36.199 Clarifiation of test times for TCF.
1014.16: 188.8.131.52 Better define failure criteria.
1014.16: 184.108.40.206 Clarification of retest without error code.
1014.16: 220.127.116.11 Clarification of retest with error code.
1014.16: 18.104.22.168 Standards are to be calibrated once per year.
1014.16: 22.214.171.124.3 Clarification of thermal bake out.
1014.16: TABLE V Corrected typo Equivalent “L” Value for >0.40<0.50 package volume.
1015.12: TABLE 1 Notes: Corrected typos, changing “pressures” to “temperatures”.
1018.9: 2.1.2 Clarification of Quarterly calibration for other gases.
2003.13: 3.1 Typo correction diethylamine.
2003.13: 4.4 Solderability test. The test is divided into two methods: Dip and Look and BGA/CGA Surface Mount.
2009.13: 3.3.6.b i. Solder column base is misaligned such that the column is not within the perimeter of the pad.
2009.13: 3.3.6.i i. Solder column base is misaligned such that the column is not within the perimeter of the pad.
2009.13: 3.3.6.o Pad dewetting/non-wetting greater than 5% of the pad surface area.
2012.10: Complete re-write of this test method.
2017.12: 126.96.36.199.c End terminated elements with less than 50% attach adhesive visible on each side termination and or less than 75% attach visible on the end of the termination. (see figs. 2017-5, 2017-6, and 2017-7).
3013.2: 3.3.2 Pulse amplitude shall be equal to VOH (max); shall be superimposed on a dc level equal to VOH (min).
3019.2: 1.2 Corrected symbols for pi (π).
4003.2: 3.3.1 Corrected symbols for delta(Δ).
4006.2: 3.1 Corrected equation for Rg prime (RGʹ).
As you can see, it’s quite a list! If you’re used to black lines in the margins, they are not provided. This above list is your guide to the updates. You’ll need to comply with them by 8/25/2017.
This test method standard is so widely used in the electronics industry, the importance of this update is obvious. So you’ll need the new edition asap. Document Center Inc. has been providing the defense contracting community with specs and standards since 1982. You can search for and order the items you need at our webstore, www.document-center.com. Here is a link to the order page for MIL-STD-883 for your convenience. A benefit of using Document Center? Our best-in-class notification service comes free with your purchase!
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MIL-STD-883, “Microcircuits,” has been updated. The new Revision K dated 4/25/2016 has replaced the previous Revision J with Notices 1 to 5. It is available from Document Center Inc. in both paper format and for pdf download. It can also be included in our Standards Online company-wide access service. It is one of our most frequently-sold standards and used extensively thoughout the electronic industry across the globe.
When will you need to comply with the changes in MIL-STD-883 K? You have until October 24, 2016, to conform with these updates.
What are the changes in the new Revision K? Changes have been made to these Test Methods as follows:
- Test Method 1005 Steady state life/Burn-in test: TJmax changes.
- Test Method 1010 Temperature cycling: Monitoring sensor definition.
- Test Method 1014 Seal: OLT procedure updates and added new A5 procedure.
- Test Method 1015 Steady state life/Burn-in test: TJmax changes.
- Test Method 1034 Die penetrant test (for plastic devices): Polaroid film alternative.
- Test Method 2001 Constant acceleration: Add testing diagram.
- Test Method 2003 Solderability: Complete re-write. Associated change to delete IPC J-STD-002 in paragraph 2.3 of the 883 main body.
- Test Method 2009 External visual: Add chip-in-place criteria.
When do you use MIL-STD-883 K? MIL-STD-883 is used for U.S. government work, specifically to test microelectronic devices to confirm that they are suitable for use in Military and Aerospace electronic systems. As a Standard, the publication can be called out and enforced in government contracts. And, of course, since many of these products are also used for civilian purposes, the tests are frequently referenced for other applications as well.
How do I get a copy of MIL-STD-883K? There are many choices, but one of the best is to use Document Center Inc. You can search for and order standards at our webstore, www.document-center.com. Each purchase comes with our best-in-class notification service, which means that you’ll get an email each time the MIL-STD-883 (or any other standard you buy from us) is updated. Here’s a direct link to the order page for MIL-STD-883.
Document Center Inc. has been working with standards users since 1982. Many of these companies are defense contractors, so we have a long history of working with mil specs and standards. When you need a reliable and responsive organization to help you solve your compliance issues, reach out to us by phone (650-591-7600) or email (firstname.lastname@example.org). Do what thousands of other companies have done and make us your Standards Experts!
The new MIL-STD-883 Revision J, “Microcircuits,” has just been released. The Test Method Standard is the primary resource for the microcircuit tests required for military contract work here in the U.S. Compliance with the new Revision J will need to be completed by December 4, 2013.
MIL-STD-883 establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems. These include:
- basic environmental tests to determine resistance to the elements and conditions surrounding military and space operations,
- mechanical and electrical tests,
- workmanship and training procedures, and
- other requirements to ensure a uniform level of quality and reliability suitable for military applications.
Changes have been made to a broad spectrum of these various test methods. The tests that have been updated include:
- 1007.1, Agree life
- 1014.14, Seal
- 1017.3, Neutron irradiation
- 1018.7, Internal gas analysis
- 1019.9, Ionizing radiation (total dose) test procedure
- 2003.10, Solderability
- 2004.7, Lead integrity
- 2009.11, External visual
- 2010.13, Internal visual (monolithic)
- 2011.9, Bond strength (destructive bond pull test)
- 2012.9, Radiography
- 2015.14, Resistance to solvents
- 2017.10, Internal visual (hybrid)
- 2018.6, Scanning electron microscope (SEM) inspection of metallization
- 2019.9, Die shear strength
- 2022.3, Wetting balance solderability
- 2023.7, Nondestructive bond pull
- 2029.1, Ceramic chip carrier bond strength
- 2030.2, Ultrasonic inspection of die attach
- 2036.1, Resistance to soldering heat
- 2037, X-Ray Fluorescence (SRF) Scan for Tin (Sn)-Lead (Pb) Content Analysis
- 3015.9, Electrostatic discharge sensitivity classification
- 3016.1, Activation time verification
- 3023.2, Static latch-up measurements for digital CMOS microelectronic devices
- 5004.12, Screening procedures
- 5005.16, Qualification and quality conformance procedures
- 5007.8, Wafer lot acceptance
- 5011.6, Evaluation and acceptance procedures for polymeric adhesives
- 5013.1, Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers
As you can see, every test section of MIL-STD-883 has been affected with the exception of the Linear Electrical Tests (the 4000 series).
The MIL-STD-883 remains one of our best selling Military Standards, historically well-used by the semiconductor industry here in Silicon Valley. If you need a copy, you can order it at our web store, www.document-center.com. Or contact us by phone (650-591-7600), fax (650-591-7617) or email (email@example.com).
We remain one of the few reliable and timely resources for update notifications on U.S. military documents. We have a number of levels of monitoring services. Ask our sales staff which one is best suited to your requirements. After all, here at Document Center we’re Your Standards Experts.
MIL-STD-883 Revision H, entitled “Test Method Standard – Microcircuits,” is Document Center’s all-time best selling military standard. It provides approximately 700 pages of tests for microelectronic devices suitable for use within Military and Aerospace electronic systems. It includes basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; and workmanship and training procedures.
Revision H was released on 2/26/2010 and compliance with the standard was required by 9/30/2010. Usage of the standard is mandated as part of a contract with the U.S. government.
The document is intended to be used in conjunction with several other major military documents:
MIL-PRF-19500 – Semiconductor Devices, General Specification For.
MIL-PRF-38534 – Hybrid Microcircuits, General Specification For.
MIL-PRF-38535 – Integrated Circuits (Microcircuits) Manufacturing, General Specification For.
MIL-STD-1835 – Electronic Component Case Outlines.
MIL-HDBK-217 – Reliability Prediction of Electronic Equipment.
MIL-HDBK-505 – Definitions of Item Levels, Item Exchangeability, Models, and Related Terms.
There are also references to a number of industry standards that are basic to any standard library for electronic devices:
ISO 14644-1 – Cleanrooms and Associated Controlled Environments – Part 1: Classification of Air Cleanliness.
ISO 14644-2 – Cleanrooms and Associated Controlled Environments – Part 2: Specifications for Testing and Monitoring to Prove Continued Compliance with ISO 14644-1.
IPC-T-50 – Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
ANSI/NCSL Z540.3 – Requirements for the Calibration of Measuring and Test Equipment, General Requirements
ANSI/J-STD-004 – Requirements for Soldering Fluxes
ANSI/J-STD-005 Requirements for Soldering Pastes
ANSI/J-STD-006 – Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications
IPC/EIA/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.
EIA/JESD 22-B116 Wire Bond Shear Test
EIA/JESD 78 IC Latch-up Test.
EIA-557 Statistical Process Control Systems.
ASTM E263 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Iron.
ASTM E264 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Nickel.
ASTM E265 – Standard Test Method for Measuring Reaction Rates and Fast-Neutron Fluences by Radioactivation of Sulfur-32.
ASTM E666 – Standard Practice for Calculating Absorbed Dose from Gamma or X-Radiation.
ASTM E668 – Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose on Radiation Hardness Testing of Electronic Devices.
ASTM E720 – Standard Guide for Selection and Use of Neutron Sensors for Determining Neutron Spectra Employed in Radiation-Hardness Testing of Electronics.
ASTM E721 Standard Method for Determining Neutron Energy Spectra with Neutron-Activation Foils for Radiation-Hardness Testing of Electronics.
ASTM E722 – Standard Practice for Characterizing Neutron Energy Fluence Spectra in Terms of an equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics.
ASTM E801 Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices.
ASTM E831 Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis
ASTM E1249 – Minimizing Dosimetry Errors in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1250 – Standard Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt 60 Irradiators Used in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1275 – Standard Practice for Use of a Radiochromic Film Dosimetry System.
ASTM F458 – Standard Practice for Nondestructive Pull Testing of Wire Bonds.
ASTM F459 – Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds.
ASTM F526 – Standard Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests.
ASTM F1892 – Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices.
ASTM C177 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded Hot-Plate Apparatus.
ASTM C518 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus.
ASTM D150 – Standard Test Methods for A-C Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials.
ASTM D257 – Standard Test Methods for D-C Resistance or Conductance of Insulating Materials.
ASTM D1002 – Standard Test Method for Strength Properties of Adhesives in Shear by Tension Loading (Metal-to-Metal).
ASTM D3850 – Standard Test Method for Rapid Thermal Degradation of Solid Electrical Insulating Materials By Thermogravimetric Method (TGA).
The MIL-STD-883, both the current Revision H and previous editions, as well as the other standards noted above, are all available from Document Center Inc. Use our website, www.document-center.com, or phone (650-591-7600), fax (650-591-7617) or email us (firstname.lastname@example.org). Any questions or comments you may have are welcome.