Amendments issued for two top Military Microcircuit Specifications, MIL-PRF-19500P and MIL-PRF-38535J

Two of our all-time best selling military specifications for the semiconductor industry have just been modified with amendments:  MIL-PRF-19500, “Semiconductor Devices, General Specification for,” and MIL-PRF-38535, “Integrated Circuits (Microcircuits) Manufacturing, General Specification for.” The new editions are available from Document Center Inc. now.

The new 171-page MIL-PRF-19500P with Amendment 1 establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available.

It contains the performance requirement and verification methods for semiconductor devices. The main body specifies the performance requirements and requires the manufacturer to verify that their devices are capable of meeting those performance requirements.

Appendix A contains definitions of terms used throughout the specification. Appendix B contains abbreviations and symbols. Appendix C contains the Quality Management (QM) Program. Appendix D contains the quality system. Appendix E contains the standard verification system for qualified products. Appendix F has been cancelled. Appendix G contains discrete semiconductor die/ship lot acceptance. Appendix H contains critical interface and materials for semiconductor devices.

The margins of MIL-PRF-19500P with Amendment 1 are marked with asterisks to indicate modifications generated by this amendment. This was done as a convenience only and the Government assumes no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the requirements of this document based on the entire content irrespective of the marginal notations.

MIL-PRF-38535J with Amendment 1 establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for their acquisition. The intent of this 202-page specification is to allow the device manufacturer the flexibility to implement best commercial practices to the maximum extent possible while still providing product that meets military performance needs.

Appendix A is mandatory for manufacturers of device types supplied in compliance with MIL-STD-883 and forms the basis for QML classes Q and V. Appendix B is intended for space application and is required for V level devices. Appendix C is mandatory for devices requiring radiation hardness assurance (RHA). Appendix D is mandatory for statistical sampling, life test, and qualification procedures used with microcircuits.

Although the document states that marginal notations are not used to identify changes with respect to the previous issue due to the extent of the changes, there are actually a number of sections with marginal notations suggesting that these are the areas when the amendment has generated changes to the text.

All current publicly available military specifications and standards are available from Document Center Inc. at our website,  Many obsolete revisions are available as well.  Please contact us by phone (650-591-7600), fax (650-591-7617) or email ( should you need any further assistance.

MIL-M-38510 J on Microcircuits recently validated

MIL-M-38510 Revision J, titled “Microcircuits, General Specification for,” was validated on 6/29/2011 with the release of Validation Notice 3.  The notice confirms that MIL-M-38510, Revision J with Amendment 1, is still valid for procurement by the U.S. Department of Defense.

The notice also reaffirms that the specification is inactive for new design.  This means that it can only be used for replacement (replenishment) purposes.

MIL-M-38510J establishes the general requirements for monolithic, multichip, and hybrid microcircuits.  It defines the quality and reliability assurance requirements which must be met in the acquisition of microcircuits.  Detail requirements, specific characteristics of microcircuits, and other details of microcircuits that are specific to particular uses are all addressed in what are called slash sheets.

The previous validation notice, Notice 2, released in March of 2001, defined the documents that should be used in lieu of MIL-M-38510 for new design.  The bulk of the specification is covered by MIL-PRF-38535.  However, some topics are addressed by MIL-STD-1835, MIL-HDBK-780 and MIL-HDBK-983, which has since been canceled without replacement.

FYI, a review of standards is often set to a regular schedule, such as the five year cycle set by ANSI, the American National Standards Institute.  When a review confirms that the document is still good without any further changes, a validation, reaffirmation, or reapproval notice may be issued.  It may be released as a stand-alone document, as with the DoD validation notices, or as a reprint with the reapproval date included, or just as a notation on a website or catalog.  When this occurs, the actual content of the document is unchanged.

MIL-M-38510, and all publicly available Military Specifications and Standards, can be purchased from Document Center Inc. at our website  You will get free update notification of all future changes to any purchases via our email notification service.  This means that you will always know when any standard you purchase from Document Center Inc. changes.  Get more information by phone (650-591-7600), fax (650-591-7617) or email (



MIL-STD-883 H – The DoD’s top standard for Microcircuits — Plus a list of other relevant standards

MIL-STD-883 Revision H, entitled “Test Method Standard – Microcircuits,” is Document Center’s all-time best selling military standard.  It provides approximately 700 pages of tests for microelectronic devices suitable for use within Military and Aerospace electronic systems.  It includes basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; and workmanship and training procedures.

Revision H was released on 2/26/2010 and compliance with the standard was required by 9/30/2010.  Usage of the standard is mandated as part of a contract with the U.S. government.

The document is intended to be used in conjunction with several other major military documents:
MIL-PRF-19500 – Semiconductor Devices, General Specification For.
MIL-PRF-38534 – Hybrid Microcircuits, General Specification For.
MIL-PRF-38535 – Integrated Circuits (Microcircuits) Manufacturing, General Specification For.
MIL-STD-1835 – Electronic Component Case Outlines.
MIL-HDBK-217 – Reliability Prediction of Electronic Equipment.
MIL-HDBK-505 – Definitions of Item Levels, Item Exchangeability, Models, and Related Terms.

There are also references to a number of industry standards that are basic to any standard library for electronic devices:

ISO 14644-1 – Cleanrooms and Associated Controlled Environments – Part 1: Classification of Air Cleanliness.
ISO 14644-2 – Cleanrooms and Associated Controlled Environments – Part 2: Specifications for Testing and Monitoring to Prove Continued Compliance with ISO 14644-1.
IPC-T-50 – Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
ANSI/NCSL Z540.3 – Requirements for the Calibration of Measuring and Test Equipment, General Requirements
ANSI/J-STD-004 – Requirements for Soldering Fluxes
ANSI/J-STD-005 Requirements for Soldering Pastes
ANSI/J-STD-006 – Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications
IPC/EIA/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.
EIA/JESD 22-B116 Wire Bond Shear Test
EIA/JESD 78 IC Latch-up Test.
EIA-557 Statistical Process Control Systems.
ASTM E263 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Iron.
ASTM E264 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Nickel.
ASTM E265 – Standard Test Method for Measuring Reaction Rates and Fast-Neutron Fluences by Radioactivation of Sulfur-32.
ASTM E666 – Standard Practice for Calculating Absorbed Dose from Gamma or X-Radiation.
ASTM E668 – Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose on Radiation Hardness Testing of Electronic Devices.
ASTM E720 – Standard Guide for Selection and Use of Neutron Sensors for Determining Neutron Spectra Employed in Radiation-Hardness Testing of Electronics.
ASTM E721 Standard Method for Determining Neutron Energy Spectra with Neutron-Activation Foils for Radiation-Hardness Testing of Electronics.
ASTM E722 – Standard Practice for Characterizing Neutron Energy Fluence Spectra in Terms of an equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics.
ASTM E801 Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices.
ASTM E831 Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis
ASTM E1249 – Minimizing Dosimetry Errors in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1250 – Standard Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt 60 Irradiators Used in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1275 – Standard Practice for Use of a Radiochromic Film Dosimetry System.
ASTM F458 – Standard Practice for Nondestructive Pull Testing of Wire Bonds.
ASTM F459 – Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds.
ASTM F526 – Standard Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests.
ASTM F1892 – Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices.
ASTM C177 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded Hot-Plate Apparatus.
ASTM C518 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus.
ASTM D150 – Standard Test Methods for A-C Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials.
ASTM D257 – Standard Test Methods for D-C Resistance or Conductance of Insulating Materials.
ASTM D1002 – Standard Test Method for Strength Properties of Adhesives in Shear by Tension Loading (Metal-to-Metal).
ASTM D3850 – Standard Test Method for Rapid Thermal Degradation of Solid Electrical Insulating Materials By Thermogravimetric Method (TGA).

The MIL-STD-883, both the current Revision H and previous editions, as well as the other standards noted above, are all available from Document Center Inc.  Use our website,, or phone (650-591-7600), fax (650-591-7617) or email us (  Any questions or comments you may have are welcome.