MIL-STD-883 K updated with New Change 2

MIL-STD-883, Microcircuits, has been updated.  The new release is Revision K with Change Notice 2.  It is available from Document Center Inc. now in both paper format and  for pdf download.  This is an essential test method  standard for the electronics industry.  You’ll want the new edition if you use this document.

While the Change Notice 1 for Revision K focused in on only 1 test method (1018 on internal gas analysis was completely rewritten), Change Notice 2 has a long list of corrections.  Here is the summary straight from the document itself:

1005.11: TABLE 1 Notes: Corrected typo, changing “pressures” to “temperatures”
1014.16: 1.1.c Note added to provide clarification of the conversion.
1014.16: Clarifiation of the mass spectometer’s sensitivity.
1014.16: 2.4.4 Clarifiation of the mass spectometer’s sensitivity.
1014.16: Clarifiation of test times for TCF.
1014.16: Better define failure criteria.
1014.16: Clarification of retest without error code.
1014.16: Clarification of retest with error code.
1014.16: Standards are to be calibrated once per year.
1014.16: Clarification of thermal bake out.
1014.16: TABLE V Corrected typo Equivalent “L” Value for >0.40<0.50 package volume.
1015.12: TABLE 1 Notes: Corrected typos, changing “pressures” to “temperatures”.
1018.9: 2.1.2 Clarification of Quarterly calibration for other gases.
2003.13: 3.1 Typo correction diethylamine.
2003.13: 4.4 Solderability test. The test is divided into two methods: Dip and Look and BGA/CGA Surface Mount.
2009.13: 3.3.6.b i. Solder column base is misaligned such that the column is not within the perimeter of the pad.
2009.13: 3.3.6.i i. Solder column base is misaligned such that the column is not within the perimeter of the pad.
2009.13: 3.3.6.o Pad dewetting/non-wetting greater than 5% of the pad surface area.
2012.10: Complete re-write of this test method.

2017.12: End terminated elements with less than 50% attach adhesive visible on each side termination and or less than 75% attach visible on the end of the termination. (see figs. 2017-5, 2017-6, and 2017-7).
3013.2: 3.3.2 Pulse amplitude shall be equal to VOH (max); shall be superimposed on a dc level equal to VOH (min).
3019.2: 1.2 Corrected symbols for pi (π).
4003.2: 3.3.1 Corrected symbols for delta(Δ).
4006.2: 3.1 Corrected equation for Rg prime (RGʹ).

As you can see, it’s quite a list! If you’re used to black lines in the margins, they are not provided.  This above list is your guide to the updates.  You’ll need to comply with them by 8/25/2017.

This test method standard is so widely used in the electronics industry, the importance of this update is obvious.  So you’ll need the new edition asap.  Document Center Inc. has been providing the defense contracting community with specs and standards since 1982.  You can search for and order the items you need at our webstore,  Here is a link to the order page for MIL-STD-883 for your convenience.  A benefit of using Document Center?  Our best-in-class notification service comes free with your purchase!

Document Center Inc. works with folks like you to help you create and maintain your compliance documentation.  We have a wide range of products and services geared to keep your standards current and complete.  If you have questions about how we can help you, just get in touch by phone (650-591-7600) or email (  Make us your Standards Experts!

New MIL-STD-883 K – Microcircuits

MIL-STD-883, “Microcircuits,” has been updated.  The new Revision K dated 4/25/2016 has replaced the previous Revision J with Notices 1 to 5.  It is available from Document Center Inc. in both paper format and for pdf download.  It can also be included in our Standards Online company-wide access service.  It is one of our most frequently-sold standards and used extensively thoughout the electronic industry across the globe.

When will you need to comply with the changes in MIL-STD-883 K?  You have until October 24, 2016, to conform with these updates.

What are the changes in the new Revision K?  Changes have been made to these Test Methods as follows:

  • Test Method 1005 Steady state life/Burn-in test: TJmax changes.
  • Test Method 1010 Temperature cycling: Monitoring sensor definition.
  • Test Method 1014 Seal: OLT procedure updates and added new A5 procedure.
  • Test Method 1015 Steady state life/Burn-in test: TJmax changes.
  • Test Method 1034 Die penetrant test (for plastic devices): Polaroid film alternative.
  • Test Method 2001 Constant acceleration: Add testing diagram.
  • Test Method 2003 Solderability: Complete re-write. Associated change to delete IPC J-STD-002 in paragraph 2.3 of the 883 main body.
  • Test Method 2009 External visual: Add chip-in-place criteria.

When do you use MIL-STD-883 K?  MIL-STD-883 is used for U.S. government work, specifically to test microelectronic devices to confirm that they are suitable for use in Military and Aerospace electronic systems.  As a Standard, the publication can be called out and enforced in government contracts.  And, of course, since many of these products are also used for civilian purposes, the tests are frequently referenced for other applications as well.

How do I get a copy of MIL-STD-883K?  There are many choices, but one of the best is to use Document Center Inc.  You can search for and order standards at our webstore,  Each purchase comes with our best-in-class notification service, which means that you’ll get an email each time the MIL-STD-883 (or any other standard you buy from us) is updated.  Here’s a direct link to the order page for MIL-STD-883.

Document Center Inc. has been working with standards users since 1982.  Many of these companies are defense contractors, so we have a long history of working with mil specs and standards.  When you need a reliable and responsive organization to help you solve your compliance issues, reach out to us by phone (650-591-7600) or email (  Do what thousands of other companies have done and make us your Standards Experts!

MIL-STD-883 J on Microcircuits updated again!

It seems like only yesterday that I blogged about the new MIL-STD-883 J with Change Notice 3 on Microcircuit Testing…  Actually it was on June 30th!  (Here’s the link to my review of MIL-STD-883J with Notice 3.)  And now there’s already a new MIL-STD-883 J with Change Notice 4!

Since I’ve reviewed the document a number of times, I won’t go over the basics of this test method standard.  But I know you’d like to learn what’s behind this rapid release of another update.  It turns out that in Test Method 2010, an error was inadvertently inserted into paragraph  This revision corrects that error.

You may ask how you’re going to keep up with these types of changes.  They’re hard to track and harder to disseminate throughout your organization.  Well, Document Center has a solution for that!  Our new Standards Online subscription access service may be the answer you’re looking for.  Standards Online allows authorized access to the standards you use for multiple folks in your company.  It’s a yearly subscription to online access for your custom collection of standards.

Let’s use MIL-STD-883 as an example of the benefits of the Standards Online service.  If it was part of your collection, the new edition would have automatically been posted to your Standards Online collection when it was released.  This means that your staff would have automatically been able to use the latest edition without you having to worry about it!  And because this service provides online access, you can easily use your standards 24/7 where ever you happen to be!

If you need online access to a specific standards collection across your organization — 24/7, let Document Center help you out!  We’ve been providing standards to folks like you since 1982 and have the expertise to insure your compliance documents are in tip-top shape.  Get in touch with us by phone (650-591-7600), fax (650-591-7617) or email (  And you can always search for and order any standard you need at our webstore,  Make us your Standards Experts!

New MIL-STD-883 J with Notice 3 for Microcircuits

MIL-STD-883, “Microcircuits,” has just been updated and the new Revision J with Change Notice 3 is available from Document Center Inc. in either paper format or for pdf download.  This update replaces Revision J with Change Notice 2 from March of this year.  Compliance by 12/17/2014 is mandatory.

This Test Method Standard is a mainstay of the electronics industry.  I’ve blogged about it a number of times (my most recent posting was on 3/24/2014).  It contains the various test methods that may be called out in government contacts for procuring microcircuits or products that contain microcircuits.

Changes in the Notice 3 are as follows:

  • Paragraph 4.7 has been changed to recommend the use of biobased materials to the maximum extent possible.
  • For Test Method 5004 on screening procures, there’s been a modification of Table 1 so that the requirements are aligned with those of MIL-PRF-38535.
  • Test Method 5005 on Qualification and Quality Conformance Procedures has been updated.  Tables 1 thru 5 have been harmonized with the requirements of MIL-PRF-38535 as well.

You may find it difficult to keep up with a standard like this that changes multiple times during the year.  One easy solution is to get the Standards Online subscription service!  This Document Center program provides you with online access to specific documents of your choosing.  It’s an annual subscription and if any of the standards in your service change during the year, you get access to the updated copy at no additional charge!

Since usage is based on “concurrent users” (how many people can look at the document at 1 time), not only do you get the automatic update feature, but it’s also possible for more than 1 person in the organization to have access to the information as well.

If this sounds like something that can benefit your organization, get in touch with our staff.  You can reach them by phone (650-591-7600), fax (650-591-7617) or email (

And if you just need to purchase the standard, you can do it online at  This is our webstore, with a catalog of over 450,000 unique standards titles for you to choose from.  Document Center’s been providing technical information to the defense and high-tech industry for over 30 years.  We’d like to be your Standards Experts too!

New MIL-STD-883 Includes Revision J with Changes 1 and 2

A new edition of the popular MIL-STD-883, “Microcircuits,” has been released and is available now from Document Center in either paper format or for pdf download.  The 759 page update includes Revision J plus Change Notices 1 and 2.  The new changes to the Test Method Standard are effective immediately, which means you need the new copy right away if you need to meet it’s requirements for any contracts you have.

I’ve blogged about the MIL-STD-883 before, since it is one of the most frequently ordered mil standards we sell.  So please review my blog on the new MIL-STD-883 Revision J and my blog on the new MIL-STD-883J with Change Notice 1 for more information on previous updates.

The change in this new release is minimal:  Method 2010 is changed.  Now in the test method “INTERNAL VISUAL (MONOLITHIC),” Section for Metallization scratches, Paragraph h for Scratch (Probe Mark(s), etc.) the “or” has been changed to “and”, which means it requires a dual criteria for failure.

Back in the olden days, just a two page change notice would have been released.  The cover sheet would have summarized the changes, while a second page would have been available, either for pen-and-ink changes or as a reprint of the changed page itself meant to replace the original page.  (If you worked with Mil Standards back then, I’m sure you remember removing and replacing pages in various documents with some regularity.)

Now that the Mil Specs and Standards are all maintained as electronic documents, changes are issued as a complete corrected republication of the document.  Yes, this standard is 759 pages.  And the change on 1 page has resulted in the reissuing of the entire MIL-STD-883!

As long as we’re reviewing this MIL Standard, I also would like to mention the numbering system of the various test methods that are included in the document.  When you get the standard, you’ll notice that Test Method 2010 is now labelled “Method 2010.14” and dated March 14, 2014.  In the previous edition (Revision J with Change Notice 1), the test method was labelled “Method 2010.13” and dated June 7, 2013.  The Method 2010 is the number of the test method (in this case, INTERNAL VISUAL (MONOLITHIC)) and the .14 is the release number.

The other thing to remember about these test method standards is that each test method is numbered separately.  So the 1st page of test method 2010 is page 1, not 233 which is the actual page if calculated numerically with page 1 being the cover sheet.

If you need the latest edition of MIL-STD-883, you can use the Document Center webstore at  Or you can contact our sales staff by phone (650-591-7600), fax (650-591-7617) or email (  You’ll use us to purchase your mil specs and standards so you’ll be informed when changes to your documents are issued.  Face it,  there’s no other resource you can turn to for consistent information on changes like Document Center Inc.  The combination of our website features, our blogs and our notification and reporting services make it easy to use and maintain your conformance standards collections.  Make us your Standards Experts!

MIL-STD-883 Revision J issued with new Change Notice 1

MIL-STD-883 J, “Test Method Standard, Microcircuits,” has just been modified by a new Change Notice 1 and compliance to the new document is mandated by May 6, 2014.  As probably the most widely used document for microcircuit testing, all users will want to review this new edition to assure that their processes meet the most current requirements.  You’ll need to be especially careful if you look for your copy on the Internet.  Here at Document Center we find many obsolete editions at the top of the search page when we look for many standards, and this is no exception.

What is the MIL-STD-883?  It’s a compendium of tests that are used to support the military procurement of microcircuits and products where microcircuits are a component.  Coverage includes environmental tests, mechanical tests, digital electrical tests, linear electrical tests, and various procedures like limit testing and screening.

Why use MIL-STD-883?  Firstly, if you have a U.S. government contract that requires meeting one or more of the tests in the standard, you’re obliged to meet the standard in order to have your product approved for acceptance.  But with the alignment of government and industry (particularly the aerospace industry) needs in this regards, usage of the standard extends far beyond the needs of the military.  So you may find you use MIL-STD-883 for other applications.

What is the current edition of the MIL-STD-883?  Currently (11/25/2013) the latest edition is the MIL-STD-883 Revision J with Change 1 interfiled.  Since the document can be changed without prior notification, you may want to have an organization like Document Center monitor it for you.  This way you can 1.  review the status on the Document Center website at any time and 2. get email notifications when any changes to the standard occur.

What are the changes in the Change 1 for MIL-STD-883J?  Two tests methods are affected by this latest change.  The existing Method 2003 (now 2003.11) on solderability has been updated for lead testing of Column Grid Array and Ball Grid Array packages.  And a new Method 2038 has been addedon the destructive lead pull test of solder column packages.  It should be no surprise to users of the standard that both modifications have to do with the use of lead in electronic components.

When do I have to meet the requirements of the new MIL-STD-883 tests?  You’ll want to comply by 5/6/2014, as is noted on the cover of the new revision.

Where can I get a copy of MIL-STD-883?  Of course, you can use your normal military resources to get your copy.  But if you’d like additional services like our monitoring service, you’re welcome to order the standard from us, Document Center Inc.

The new edition is available in both paper format and for pdf download.  It can be found on our website,  Just search for MIL-STD-883.  Or you can contact us by phone (650-591-7600), fax (650-591-7617) or email (  We’re happy to assist you with any requirements, questions, or issues you may have.  Remember what thousands of companies like yours already know – We’re your Standards Experts!

New MIL-STD-883 Revision J for Microcircuit Tests

The new MIL-STD-883 Revision J, “Microcircuits,” has just been released.  The Test Method Standard is the primary resource for the microcircuit tests required for military contract work here in the U.S.  Compliance with the new Revision J will need to be completed by December 4, 2013.

MIL-STD-883 establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems.  These include:

  • basic environmental tests to determine resistance to the elements and conditions surrounding military and space operations,
  • mechanical and electrical tests,
  • workmanship and training procedures, and
  • other requirements to ensure a uniform level of quality and reliability suitable for military applications.

Changes have been made to a broad spectrum of these various test methods.  The tests that have been updated include:

  • 1007.1, Agree life
  • 1014.14, Seal
  • 1017.3, Neutron irradiation
  • 1018.7, Internal gas analysis
  • 1019.9, Ionizing radiation (total dose) test procedure
  • 2003.10, Solderability
  • 2004.7, Lead integrity
  • 2009.11, External visual
  • 2010.13, Internal visual (monolithic)
  • 2011.9, Bond strength (destructive bond pull test)
  • 2012.9, Radiography
  • 2015.14, Resistance to solvents
  • 2017.10, Internal visual (hybrid)
  • 2018.6, Scanning electron microscope (SEM) inspection of metallization
  • 2019.9, Die shear strength
  • 2022.3, Wetting balance solderability
  • 2023.7, Nondestructive bond pull
  • 2029.1, Ceramic chip carrier bond strength
  • 2030.2, Ultrasonic inspection of die attach
  • 2036.1, Resistance to soldering heat
  • 2037, X-Ray Fluorescence (SRF) Scan for Tin (Sn)-Lead (Pb) Content Analysis
  • 3015.9, Electrostatic discharge sensitivity classification
  • 3016.1, Activation time verification
  • 3023.2, Static latch-up measurements for digital CMOS microelectronic devices
  • 5004.12, Screening procedures
  • 5005.16, Qualification and quality conformance procedures
  • 5007.8, Wafer lot acceptance
  • 5011.6, Evaluation and acceptance procedures for polymeric adhesives
  • 5013.1, Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers

As you can see, every test section of MIL-STD-883 has been affected with the exception of the Linear Electrical Tests (the 4000 series).

The MIL-STD-883 remains one of our best selling Military Standards, historically well-used by the semiconductor industry here in Silicon Valley.  If you need a copy, you can order it at our web store,  Or contact us by phone (650-591-7600), fax (650-591-7617) or email (

We remain one of the few reliable and timely resources for update notifications on U.S. military documents.  We have a number of levels of monitoring services.  Ask our sales staff which one is best suited to your requirements.  After all, here at Document Center we’re Your Standards Experts.

MIL-STD-883 H – The DoD’s top standard for Microcircuits — Plus a list of other relevant standards

MIL-STD-883 Revision H, entitled “Test Method Standard – Microcircuits,” is Document Center’s all-time best selling military standard.  It provides approximately 700 pages of tests for microelectronic devices suitable for use within Military and Aerospace electronic systems.  It includes basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; and workmanship and training procedures.

Revision H was released on 2/26/2010 and compliance with the standard was required by 9/30/2010.  Usage of the standard is mandated as part of a contract with the U.S. government.

The document is intended to be used in conjunction with several other major military documents:
MIL-PRF-19500 – Semiconductor Devices, General Specification For.
MIL-PRF-38534 – Hybrid Microcircuits, General Specification For.
MIL-PRF-38535 – Integrated Circuits (Microcircuits) Manufacturing, General Specification For.
MIL-STD-1835 – Electronic Component Case Outlines.
MIL-HDBK-217 – Reliability Prediction of Electronic Equipment.
MIL-HDBK-505 – Definitions of Item Levels, Item Exchangeability, Models, and Related Terms.

There are also references to a number of industry standards that are basic to any standard library for electronic devices:

ISO 14644-1 – Cleanrooms and Associated Controlled Environments – Part 1: Classification of Air Cleanliness.
ISO 14644-2 – Cleanrooms and Associated Controlled Environments – Part 2: Specifications for Testing and Monitoring to Prove Continued Compliance with ISO 14644-1.
IPC-T-50 – Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
ANSI/NCSL Z540.3 – Requirements for the Calibration of Measuring and Test Equipment, General Requirements
ANSI/J-STD-004 – Requirements for Soldering Fluxes
ANSI/J-STD-005 Requirements for Soldering Pastes
ANSI/J-STD-006 – Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications
IPC/EIA/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.
EIA/JESD 22-B116 Wire Bond Shear Test
EIA/JESD 78 IC Latch-up Test.
EIA-557 Statistical Process Control Systems.
ASTM E263 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Iron.
ASTM E264 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Nickel.
ASTM E265 – Standard Test Method for Measuring Reaction Rates and Fast-Neutron Fluences by Radioactivation of Sulfur-32.
ASTM E666 – Standard Practice for Calculating Absorbed Dose from Gamma or X-Radiation.
ASTM E668 – Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose on Radiation Hardness Testing of Electronic Devices.
ASTM E720 – Standard Guide for Selection and Use of Neutron Sensors for Determining Neutron Spectra Employed in Radiation-Hardness Testing of Electronics.
ASTM E721 Standard Method for Determining Neutron Energy Spectra with Neutron-Activation Foils for Radiation-Hardness Testing of Electronics.
ASTM E722 – Standard Practice for Characterizing Neutron Energy Fluence Spectra in Terms of an equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics.
ASTM E801 Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices.
ASTM E831 Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis
ASTM E1249 – Minimizing Dosimetry Errors in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1250 – Standard Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt 60 Irradiators Used in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1275 – Standard Practice for Use of a Radiochromic Film Dosimetry System.
ASTM F458 – Standard Practice for Nondestructive Pull Testing of Wire Bonds.
ASTM F459 – Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds.
ASTM F526 – Standard Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests.
ASTM F1892 – Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices.
ASTM C177 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded Hot-Plate Apparatus.
ASTM C518 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus.
ASTM D150 – Standard Test Methods for A-C Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials.
ASTM D257 – Standard Test Methods for D-C Resistance or Conductance of Insulating Materials.
ASTM D1002 – Standard Test Method for Strength Properties of Adhesives in Shear by Tension Loading (Metal-to-Metal).
ASTM D3850 – Standard Test Method for Rapid Thermal Degradation of Solid Electrical Insulating Materials By Thermogravimetric Method (TGA).

The MIL-STD-883, both the current Revision H and previous editions, as well as the other standards noted above, are all available from Document Center Inc.  Use our website,, or phone (650-591-7600), fax (650-591-7617) or email us (  Any questions or comments you may have are welcome.