Tag: MIL-STD-883H

New MIL-STD-883 Revision J for Microcircuit Tests

The new MIL-STD-883 Revision J, “Microcircuits,” has just been released.  The Test Method Standard is the primary resource for the microcircuit tests required for military contract work here in the U.S.  Compliance with the new Revision J will need to be completed by December 4, 2013.

MIL-STD-883 establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems.  These include:

  • basic environmental tests to determine resistance to the elements and conditions surrounding military and space operations,
  • mechanical and electrical tests,
  • workmanship and training procedures, and
  • other requirements to ensure a uniform level of quality and reliability suitable for military applications.

Changes have been made to a broad spectrum of these various test methods.  The tests that have been updated include:

  • 1007.1, Agree life
  • 1014.14, Seal
  • 1017.3, Neutron irradiation
  • 1018.7, Internal gas analysis
  • 1019.9, Ionizing radiation (total dose) test procedure
  • 2003.10, Solderability
  • 2004.7, Lead integrity
  • 2009.11, External visual
  • 2010.13, Internal visual (monolithic)
  • 2011.9, Bond strength (destructive bond pull test)
  • 2012.9, Radiography
  • 2015.14, Resistance to solvents
  • 2017.10, Internal visual (hybrid)
  • 2018.6, Scanning electron microscope (SEM) inspection of metallization
  • 2019.9, Die shear strength
  • 2022.3, Wetting balance solderability
  • 2023.7, Nondestructive bond pull
  • 2029.1, Ceramic chip carrier bond strength
  • 2030.2, Ultrasonic inspection of die attach
  • 2036.1, Resistance to soldering heat
  • 2037, X-Ray Fluorescence (SRF) Scan for Tin (Sn)-Lead (Pb) Content Analysis
  • 3015.9, Electrostatic discharge sensitivity classification
  • 3016.1, Activation time verification
  • 3023.2, Static latch-up measurements for digital CMOS microelectronic devices
  • 5004.12, Screening procedures
  • 5005.16, Qualification and quality conformance procedures
  • 5007.8, Wafer lot acceptance
  • 5011.6, Evaluation and acceptance procedures for polymeric adhesives
  • 5013.1, Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers

As you can see, every test section of MIL-STD-883 has been affected with the exception of the Linear Electrical Tests (the 4000 series).

The MIL-STD-883 remains one of our best selling Military Standards, historically well-used by the semiconductor industry here in Silicon Valley.  If you need a copy, you can order it at our web store, www.document-center.com.  Or contact us by phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com).

We remain one of the few reliable and timely resources for update notifications on U.S. military documents.  We have a number of levels of monitoring services.  Ask our sales staff which one is best suited to your requirements.  After all, here at Document Center we’re Your Standards Experts.

MIL-STD-883 H – The DoD’s top standard for Microcircuits — Plus a list of other relevant standards

MIL-STD-883 Revision H, entitled “Test Method Standard – Microcircuits,” is Document Center’s all-time best selling military standard.  It provides approximately 700 pages of tests for microelectronic devices suitable for use within Military and Aerospace electronic systems.  It includes basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; and workmanship and training procedures.

Revision H was released on 2/26/2010 and compliance with the standard was required by 9/30/2010.  Usage of the standard is mandated as part of a contract with the U.S. government.

The document is intended to be used in conjunction with several other major military documents:
MIL-PRF-19500 – Semiconductor Devices, General Specification For.
MIL-PRF-38534 – Hybrid Microcircuits, General Specification For.
MIL-PRF-38535 – Integrated Circuits (Microcircuits) Manufacturing, General Specification For.
MIL-STD-1835 – Electronic Component Case Outlines.
MIL-HDBK-217 – Reliability Prediction of Electronic Equipment.
MIL-HDBK-505 – Definitions of Item Levels, Item Exchangeability, Models, and Related Terms.

There are also references to a number of industry standards that are basic to any standard library for electronic devices:

ISO 14644-1 – Cleanrooms and Associated Controlled Environments – Part 1: Classification of Air Cleanliness.
ISO 14644-2 – Cleanrooms and Associated Controlled Environments – Part 2: Specifications for Testing and Monitoring to Prove Continued Compliance with ISO 14644-1.
IPC-T-50 – Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
ANSI/NCSL Z540.3 – Requirements for the Calibration of Measuring and Test Equipment, General Requirements
ANSI/J-STD-004 – Requirements for Soldering Fluxes
ANSI/J-STD-005 Requirements for Soldering Pastes
ANSI/J-STD-006 – Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications
IPC/EIA/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.
EIA/JESD 22-B116 Wire Bond Shear Test
EIA/JESD 78 IC Latch-up Test.
EIA-557 Statistical Process Control Systems.
ASTM E263 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Iron.
ASTM E264 – Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation of Nickel.
ASTM E265 – Standard Test Method for Measuring Reaction Rates and Fast-Neutron Fluences by Radioactivation of Sulfur-32.
ASTM E666 – Standard Practice for Calculating Absorbed Dose from Gamma or X-Radiation.
ASTM E668 – Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose on Radiation Hardness Testing of Electronic Devices.
ASTM E720 – Standard Guide for Selection and Use of Neutron Sensors for Determining Neutron Spectra Employed in Radiation-Hardness Testing of Electronics.
ASTM E721 Standard Method for Determining Neutron Energy Spectra with Neutron-Activation Foils for Radiation-Hardness Testing of Electronics.
ASTM E722 – Standard Practice for Characterizing Neutron Energy Fluence Spectra in Terms of an equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics.
ASTM E801 Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices.
ASTM E831 Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis
ASTM E1249 – Minimizing Dosimetry Errors in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1250 – Standard Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt 60 Irradiators Used in Radiation Hardness Testing of Silicon Electronic Devices.
ASTM E1275 – Standard Practice for Use of a Radiochromic Film Dosimetry System.
ASTM F458 – Standard Practice for Nondestructive Pull Testing of Wire Bonds.
ASTM F459 – Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds.
ASTM F526 – Standard Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests.
ASTM F1892 – Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices.
ASTM C177 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded Hot-Plate Apparatus.
ASTM C518 – Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus.
ASTM D150 – Standard Test Methods for A-C Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials.
ASTM D257 – Standard Test Methods for D-C Resistance or Conductance of Insulating Materials.
ASTM D1002 – Standard Test Method for Strength Properties of Adhesives in Shear by Tension Loading (Metal-to-Metal).
ASTM D3850 – Standard Test Method for Rapid Thermal Degradation of Solid Electrical Insulating Materials By Thermogravimetric Method (TGA).

The MIL-STD-883, both the current Revision H and previous editions, as well as the other standards noted above, are all available from Document Center Inc.  Use our website, www.document-center.com, or phone (650-591-7600), fax (650-591-7617) or email us (info@document-center.com).  Any questions or comments you may have are welcome.