Tag: Solderability Tests for Component Leads Terminations Lugs Terminals and Wires

The new EIA/IPC/JEDEC J-STD-002 Revision D is shipping!

Well, the wait is over!  The new EIA/IPC/JEDEC J-STD-002, “Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires,” is shipping now.  This Revision D dated June 2013 is the replacement for J-STD-002C with Amendment 1 (now obsolete).  It is a joint publication of ECIA, IPC and JEDEC.

The standard is intended to be used by both the vendor and the user.  It has a series of visual acceptance criteria tests and force measurement tests to be used to assess the solderability of various electronic components.  These assessments are used at the time of manufacture, at the receipt of the components by the user, or just before assembly and soldering.

I reviewed the technical changes for this new edition in a previous Standards Forum blog towards the end of last year.

The release of the new edition took far longer than expected due to the administrative processes at the three associations, as well as printing time once the final draft was sent to the printers for publication.  It’s been a long time since we first heard the new edition was approved!

If you need a copy of this new J-STD-002 Revision D, order it at our web store, www.document-center.com.  The document is in stock and will be able to ship immediately for you.  More questions?  Get in touch with our staff via phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com).  We’ll be able to assist you — We’re Your Standards Experts!

The new J STD 002D, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, due soon!

In the world of electronic assembly and component/printed wiring board fabrication, there is no greater mandate than to develop lead-free technology.  So it is with great anticipation that the new J-STD-002 Revision D, “Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires,” is welcomed into the world!  The new revision is a step forward in this regards and can be pre-ordered now from Document Center Inc. for expected delivery by the end of the year.

This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.  The document also includes a test method for the resistance to dissolution/dewetting of metallization.  This standard is intended for use by both vendor and user.

The new revision is a joint publication of IPC, JEDEC, and ECA (soon to be the Electronic Components Industry Association (ECIA) with the meager of the Electronic Components Association (ECA) and the National Electronic Distributors Association (NEDA).  Additionally, the joint committee worked with IEC to develop compatibility between the IEC 60068-2-20 Soldering specification and this new revision of J STD 002.

Significant testing has gone into the development of this new standard.  Why?  Because of the use of a new ROL0 type flux to replace the previous R type, which has proved inconsistant, providing false negative solderability test results.

This new standard activated flux composition, analyzed by NIST, Bill Russell, and Raytheon Systems, has proved to greatly reduce the amount of test variation, which is expected to reduce costs and improve consistency throughout industry.  Not only that, but the committee checked in with flux suppliers to make sure that the new composition will be readily available!

All IPC, JEDEC and EIA standards are available from Document Center Inc. at our website, www.document-center.com.  Or consider contacting us by phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com).  We can assist you with all your standards purchases and requirements, as well as the monitoring/updating of your collection.