MIL-STD-883, Microcircuits, has been updated. The new release is Revision K with Change Notice 2. It is available from Document Center Inc. now in both paper format and for pdf download. This is an essential test method standard for the electronics industry. You’ll want the new edition if you use this document.
While the Change Notice 1 for Revision K focused in on only 1 test method (1018 on internal gas analysis was completely rewritten), Change Notice 2 has a long list of corrections. Here is the summary straight from the document itself:
1005.11: TABLE 1 Notes: Corrected typo, changing “pressures” to “temperatures”
1014.16: 1.1.c Note added to provide clarification of the conversion.
1014.16: 2.1.2.3 Clarifiation of the mass spectometer’s sensitivity.
1014.16: 2.4.4 Clarifiation of the mass spectometer’s sensitivity.
1014.16: 2.4.5.1 Clarifiation of test times for TCF.
1014.16: 2.4.6.1 Better define failure criteria.
1014.16: 2.4.7.1 Clarification of retest without error code.
1014.16: 2.4.7.2 Clarification of retest with error code.
1014.16: 2.8.2.1 Standards are to be calibrated once per year.
1014.16: 2.8.3.3.3 Clarification of thermal bake out.
1014.16: TABLE V Corrected typo Equivalent “L” Value for >0.40<0.50 package volume.
1015.12: TABLE 1 Notes: Corrected typos, changing “pressures” to “temperatures”.
1018.9: 2.1.2 Clarification of Quarterly calibration for other gases.
2003.13: 3.1 Typo correction diethylamine.
2003.13: 4.4 Solderability test. The test is divided into two methods: Dip and Look and BGA/CGA Surface Mount.
2009.13: 3.3.6.b i. Solder column base is misaligned such that the column is not within the perimeter of the pad.
2009.13: 3.3.6.i i. Solder column base is misaligned such that the column is not within the perimeter of the pad.
2009.13: 3.3.6.o Pad dewetting/non-wetting greater than 5% of the pad surface area.
2012.10: Complete re-write of this test method.
2017.12: 3.1.2.1.c End terminated elements with less than 50% attach adhesive visible on each side termination and or less than 75% attach visible on the end of the termination. (see figs. 2017-5, 2017-6, and 2017-7).
3013.2: 3.3.2 Pulse amplitude shall be equal to VOH (max); shall be superimposed on a dc level equal to VOH (min).
3019.2: 1.2 Corrected symbols for pi (π).
4003.2: 3.3.1 Corrected symbols for delta(Δ).
4006.2: 3.1 Corrected equation for Rg prime (RGʹ).
As you can see, it’s quite a list! If you’re used to black lines in the margins, they are not provided. This above list is your guide to the updates. You’ll need to comply with them by 8/25/2017.
This test method standard is so widely used in the electronics industry, the importance of this update is obvious. So you’ll need the new edition asap. Document Center Inc. has been providing the defense contracting community with specs and standards since 1982. You can search for and order the items you need at our webstore, www.document-center.com. Here is a link to the order page for MIL-STD-883 for your convenience. A benefit of using Document Center? Our best-in-class notification service comes free with your purchase!
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