AMS 2418 new Revision H on Copper Plating was just released on 2/18/2011. This Aerospace Material Specification covers the requirements for electrodeposition of copper on metals and the properties of the deposit.
This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required nor permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing, but usage is not limited to such applications.
The standard is one of the primary plating spec standards in use all over the world.
It is available from Document Center Inc. at our website, www.document-center.com, via phone at 650-591-7600, fax 650-591-7617, and email email@example.com. Any questions are welcome.